The ultra-compact CX9240 and CX82xx Embedded PC series from Beckhoff open up entirely new application areas with modern multi-core ARM Cortex A53 processors.
onsemi’s new EliteSiC MOSFETs in T2PAK top-cool packaging improve thermal efficiency, reliability and design flexibility for EVs, solar and energy-storage applications.
A neural network trained on real production data minimizes surface-related deviations, improving sensor precision for demanding industrial environments.
FabEagle MES v4.3 adds web analytics, REST machine connectivity, and role-based dashboards to boost KPI accuracy, traceability, and agile production control in automated PV lines.
Designed for autonomous robotics, manufacturing equipment, and medical devices, the new modules provide industrial-grade reliability and next-generation AI computing efficiency at the edge.
The system allows for the precise simulation and optimization of high-speed robot motion control and AI visual algorithms prior to physical deployment, ensuring both real-time responsiveness and exceptional precision.
Fraunhofer, with TSRI, develops FeMFET-based nanosheet memory under 3 nm, enabling in-memory computing for energy-efficient AI chips in smartphones, cars, and medical devices.
B&R adds Codian AR to its robotics portfolio, combining six-axis mechanics and integrated control to simplify deployment in packaging, assembly, and manufacturing cells.
Simcenter X is a scalable SaaS engineering simulation suite that reduces IT complexity, enhances collaboration, and uses AI for intelligent guidance and accelerated design exploration.