Siemens has developed a standardized electrical and control reference design to streamline the deployment of high-density hardware clusters for hyperscale and cloud infrastructure providers.
Nordic Semiconductor extends AI-driven workflows from embedded software development to deployed fleet management within a unified chip-to-cloud environment.
Vision Components introduces an intelligent board-level camera platform utilizing onboard processing and high-resolution image sensors for industrial machine vision applications.
Aaronn Electronic introduces the congatec conga-HPC/mIQ-X, a COM-HPC Mini module designed for edge AI, machine vision, and industrial automation applications.
Emerson and SiMa.ai integrate edge AI computing into industrial PCs for real-time process optimization, predictive maintenance, and autonomous industrial operations.