The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.
Dassault Systèmes will present 3D UNIV+RSES at Mobile World Congress 2026 in Barcelona to support the development and scaling of connectivity and AI-driven infrastructures.
IDEKO and aerospace manufacturers demonstrate high-precision robotic machining and inspection of composite wing components at BIEMH 2026 to advance industrial automation in aerostructure production.
Long-Term Support release introduces Automation Extended architecture, modular updates and expanded virtualization for secure, stepwise process automation modernization.
Micro-Epsilon introduces the eddyNCDT 3005, a compact eddy current sensor system designed for high-precision displacement measurement and robust integration in industrial automation environments.
Beckhoff launches TwinCAT MC3, a modular multi-axis motion control software designed for multi-core industrial PCs and high-performance machines with hundreds of axes.