SECO presented its edge AI solutions and Pi Vision 10.1 CM5 platform, highlighting applications in industrial automation, medical systems, and smart building technologies at CES in Las Vegas, January 6-9, 2026.
MVTec strengthens its machine vision software by integrating high-performance neural processing hardware, enabling faster and more efficient deep learning execution on embedded smart cameras.
Balluff introduces a fanless high-speed industrial camera combining 25GigE, RDMA technology, and over 100 fps at 24.6 MP in a compact 40 × 40 mm housing.
The fact that different machine models are present at the Mecof Open Days 2025, but that they can be used in the same sector, speaks volumes about the expertise and capabilities of the Mecof team in guiding customers towards the most suitable solution in terms of space, required performance, removal capacity, level of automation and connectivity. In fact, the Ecomill Plus will be delivered in Italy for the general mechanical engineering sector.
SICK introduces a next-generation photoelectric sensor engineered for accurate object detection in demanding industrial conditions, offering enhanced robustness, advanced algorithms and smart diagnostic capabilities.
The ultra-compact CX9240 and CX82xx Embedded PC series from Beckhoff open up entirely new application areas with modern multi-core ARM Cortex A53 processors.
onsemi’s new EliteSiC MOSFETs in T2PAK top-cool packaging improve thermal efficiency, reliability and design flexibility for EVs, solar and energy-storage applications.