Trend Micro integrates threat intelligence with NVIDIA digital infrastructure to enforce operational security across agent models, runtimes, and hardware interfaces.
Infineon is introducing a new series of Hall-effect sensors featuring automated on-chip calibration to support precise rotor position feedback in brushless DC motors.
The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.
BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.
AMD collaborated with industry robotics partners to implement heterogeneous processing architectures and open software frameworks for edge-level autonomous systems.
Emerson develops a configuration management tool designed to automate data synchronization between physical plant control networks and simulated testing environments.
Bison is integrating MAE technologies into a single global product line to streamline access to motors and blowers for automated manufacturing systems.
Murrelektronik and Danfoss integrated decentralized motion control into a robotics platform to reduce wiring complexity and minimize control cabinet footprint.