Telit Cinterion and Nokia are collaborating to integrate multi-access wireless connectivity with in-network edge computing for mission-critical industrial operations.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
How Synopsys applies virtualization and simulation to support software-defined vehicle development and system-level validation across the automotive data ecosystem.
NXP Semiconductors introduces an agentic AI software foundation for low-latency, secure decision-making on edge devices across industrial, automotive, and IoT applications.
From January 6-9 in Las Vegas, Franka Robotics and NVIDIA showcase NVIDIA GR00T AI integrated with Franka Research 3, advancing embodied AI and robot learning.
Volvo Penta works with Fantuzzi Team Material Handling and TecnoGen to deploy a shared battery platform for electric material handling and mobile energy storage.
STMicroelectronics expands the STM32MP2 series with the STM32MP21 MPUs, combining low power consumption, flexible performance, and a security architecture aligned with industrial and IoT requirements.
Siemens and NVIDIA expand a long-term collaboration to integrate AI, simulation, and automation into a unified software-defined foundation for industrial engineering, production, and operations.
Universal Robots and Robotiq demonstrate a digitally simulated and physically deployed palletizing cell with Siemens at CES 2026 to illustrate data-driven automation design and operation.
The new software connects real-time operational data with high-fidelity digital twins, enabling virtual validation of products, production systems, and facilities before physical implementation.