After a successful cooperation start in Asia, both technology companies have signed a Memorandum of Understanding to intensify cooperation in the production of metallic bipolar plates for fuel cells and electrolysers in Europe.
STM32MP13 MPUs tackle applications that challenge traditional embedded microcontrollers, combining extra performance, security-rich architecture, and energy efficiency in new cost-conscious, single-core devices.
The collaboration achieves record 1.2 Tbps and 1.6 Tbps transmission rates over 10 km using distributed feedback lasers for the carrier and local oscillators.
ADLINK Technology to Showcase Latest Processor Integration and Edge AI Platforms at Embedded World 2023, with Product Managers and Key Executives on Hand to Provide Industry Insight.
The launch of a new development kit for vision system engineers who are working to develop Time-of-Flight devices for industrial and robotics applications uses Sony's IMX570 iToF Image Sensor.
A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.
ASRock Industrial will take part in the exhibition to present optimal AIoT solutions, fulfilling diverse applications in smart retail, factory automation, robot, entertainment, and security.