The Cyplan® ORC 70 NT is a new ORC module developed by Dürr that converts waste heat into clean electricity in the low-temperature range from temperatures of just 85°C.
Nidec-Shimpo Corporation announced today that it has added adopter-combined gear-head types to its FLEXWAVE series of precision control reducers currently on sale.
Thanks to its 4-megapixel (Mpx) sensor, the T4040 has advantages over cameras with traditional 1-Mpx sensors and can capture fine detail and movement over larger areas.
Kontron now offers 6th Gen Intel Atom® or Celeron® processors for its FlatClient ECO Panel PC series, which provide high computing and graphics performance with low power consumption.
Continuous development and breakthrough technologies are advancing industrial communications, enabling them to reach new heights and ultimately writing the next chapter of the digital era. One of the key innovations that is unlocking significant opportunities and cutting-edge applications is Time-Sensitive Networking (TSN).
Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.
The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.
Specialist articles on Industry 4.0 generally emphasize the aspect of technical feasibility of the consistent, intelligent networking of machines, processes and personnel: What gateways, protocols and platforms will be needed to interlink machines from different manufacturers? What legal requirements have to be observed? How can security be designed to avoid hacker attacks?.