In the age of digitalization, data is the new gold. With its new Field Data Enablement Portfolio, Siemens is now making unused field data accessible to IT and thus making manufacturing companies more efficient and future-proof.
Congatec – a leading vendor of embedded and edge computing technology – announces the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.
Insulation Resistance (IR) testing can be carried out to identify a drop in resistance caused by current leakage, enabling operators to take remedial action before serious faults or even failure occurs.
The Cyplan® ORC 70 NT is a new ORC module developed by Dürr that converts waste heat into clean electricity in the low-temperature range from temperatures of just 85°C.
Nidec-Shimpo Corporation announced today that it has added adopter-combined gear-head types to its FLEXWAVE series of precision control reducers currently on sale.
Thanks to its 4-megapixel (Mpx) sensor, the T4040 has advantages over cameras with traditional 1-Mpx sensors and can capture fine detail and movement over larger areas.
Kontron now offers 6th Gen Intel Atom® or Celeron® processors for its FlatClient ECO Panel PC series, which provide high computing and graphics performance with low power consumption.
Continuous development and breakthrough technologies are advancing industrial communications, enabling them to reach new heights and ultimately writing the next chapter of the digital era. One of the key innovations that is unlocking significant opportunities and cutting-edge applications is Time-Sensitive Networking (TSN).