28
'24
Written on
Yaskawa News
27
'24
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Nexcom News
NEXCOM LAUNCHES TCA 6710 1U RACKMOUNT POWERED BY ARM-BASED COM-HPC MODULE
This COM-HPC module represents the next generation of COM-E (COM Express) technology, with significantly improved performance.
27
'24
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Baumer News
ULTRA-FLAT BAUMER INDUCTIVE SENSOR IS PRODUCT OF THE YEAR
This inductive sensor combines a very flat design height with an exceptionally large switching distance.
26
'24
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Fraunhofer News
Cold Spin-Electronics for Quantum Technologies
The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.
26
'24
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NSK
NSK develops grease degradation diagnosis technology for on-site use
NSK is developing a world-first: a high-accuracy way of rapidly and accurately diagnosing the remaining life of lubricant grease. The company will provide the solution as a mobile app, enabling users to perform the on-site analysis of lubricant condition in bearings and linear motion systems. This innovative capability will reduce the need for grease inspection and replenishment costs, and help companies implement condition-based maintenance strategies. NSK’s is currently seeking customer input and feedback ahead of launching its new app.
26
'24
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Kollmorgen EU
Kollmorgen expands AKD2G versatility with the launch of new synchronized communication protocols
The updated Kollmorgen AKD2G servo drive features new communication protocols that support easier integration with third-party controllers while delivering industry-leading performance.
26
'24
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CoreTigo
Emerson and CoreTigo Improve Sustainability and Save Costs with Wireless Air Treatment Solution
Emerson collaborates with CoreTigo on wireless industrial automation technologies to address compressed air management challenges, reducing energy waste and CO2 emissions, and improving maintenance efficiency.
26
'24
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Infineon News
Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024
Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies.
26
'24
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Phytec News
Phytec at the embedded world: New embedded standard FPSC and SOMs with NXP i.MX 95 and i.MX 8M Plus
Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.
26
'24
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Thinesolutions News
