With the Canadian packaging industry estimated to grow to approximately 50,000 million units by 2021, the sector has huge impact on Canada’s economic future.
HCK series, in addition to the availability of standard executions, can be furtherly customisable thanks to the modularity of the elements that compose the new indicators: several material combinations, different standard lengths, furtherly customisable and executions destined to specific usages which require the use of oils and glycol-based solutions, largely used in cooling systems.
AKASOL PARTNERS WITH FRAUNHOFER RESEARCH INSTITUTION is partnering with the Fraunhofer Research Institution for Materials Recycling and Resource Strategies IWKS on a new funding project: As part of their joint project, “Bætter Recycle – Battery recycling and disassembly for eMobility and optimization through recycling-friendly design,” the two partners are working to develop automated recycling processes for the eMobility industry.
TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TCD2726DG,” a lens reduction type CCD linear image sensor that achieves high-speed scanning for A3 multifunction printers. Shipments of engineering samples[1] start today.
Applied Materials, Inc. today unveiled a major innovation in process control that uses Big Data and AI technology to help semiconductor manufacturers accelerate node development, speed time to revenue and earn more profits over the life of a node.
Yamaha Robotics SMT Section is a trusted supplier of surface-mount assembly solutions, with six generations of high-speed precision mounters in action on the RSG Elotech production lines. In this article, we look at some of the highlights of the enduring connection between our two companies.
The latest embedded devices for real-time, high-performance control of industrial automation applications with CC-Link IE TSN have been released by CLPA partner NXP Semiconductors.