19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Rockwell Automation News

Rockwell Automation Nearly Doubles Input Voltage Capacity for Compact PowerFlex Drive

The latest enhancement to the PowerFlex^® 6000T drive now accepts up to 13.8 kV primary voltage, nearly twice the input voltage, in a footprint that is only 2310…3010 mm (7.58…9.87 feet) wide. The drive can be applied to 3…4.16 kV applications with high voltage input built in. Plus, high-voltage feeds can be directly connected to the drive from the main distribution line without additional step-down transformer or substation equipment, reducing costs.

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19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Siemens News

Siemens collaborates with GlobalFoundries to provide trusted silicon photonics verification

Siemens Digital Industries Software today announced that its Calibre^® nmPlatform now enables designers to leverage the newest GlobalFoundries (GF) silicon photonics platform. GF’s next generation, monolithic platform, GF Fotonix is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.

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19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Allegro micro News

Allegro MicroSystems Announces 4x4mm 50 V Full-Bridge Gate Drivers for Automotive and Industrial Applications

Allegro MicroSystems, Inc., a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced two new full-bridge gate drivers for automotive and industrial applications. New drivers enable fewer external components and smaller footprints while improving performance.

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19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Prof. Angela Schoellig accepts Infineon Endowed Chair “Safety, Performance and Reliability of Learning Systems” at the Technical University of Munich

Prof. Angela Schoellig has accepted the Infineon Endowed Chair “Safety, Performance and Reliability of Learning Systems” at the Technical University of Munich (TUM).

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19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Framos News

FRAMOS Makes Next-Generation GMSL3 Accessible for Any Embedded Vision Application

FRAMOS, a global supplier of custom vision solutions and imaging components, is leading the market to integrate Analog Devices’ new GMSL3 technology in the embedded vision environment.

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19 {{ "2022-05-19T00:00:00+00:00" | date "MMM" }} '22

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Kontron News

SYSTEM-ON-MODULE SL I.MX6 UL NOW AVAILABLE WITH CODESYS^® SOFTSPS

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), has expanded its system-on-module SL i.MX6 UL to include the leading manufacturer-independent IEC-61131-3 automation software CODESYS^® for project management in industrial control systems. The modern, hardware-independent development interface permits fast and easy handling of complex control assignments.

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18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

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Diodes Incorporated News

32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

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18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

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Congatec News

congatec simplifies Arm deployments with i.MX 8M Plus

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

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18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

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Intepro Systems News

Upgrading ATE Test Stations with Intepro

Intepro’s upgrade solutions improve workflow and provide value.

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18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

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TE Connectivity News

TE Connectivity and Phoenix Contact announce joint development agreement for Single Pair Ethernet hybrid cable assemblies

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

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Market Overview

How Automation is Redefining the Modern Supply Chain

Technical Articles

Emerson Relaunches ASCO Series Solenoid Valve

Case studies

Comau and Foton Daimler Partner for Advanced Truck Production

Rockwell Automation Nearly Doubles Input Voltage Capacity for Compact PowerFlex Drive

Siemens collaborates with GlobalFoundries to provide trusted silicon photonics verification

Allegro MicroSystems Announces 4x4mm 50 V Full-Bridge Gate Drivers for Automotive and Industrial Applications

Prof. Angela Schoellig accepts Infineon Endowed Chair “Safety, Performance and Reliability of Learning Systems” at the Technical University of Munich

Prof. Angela Schoellig has accepted the Infineon Endowed Chair “Safety, Performance and Reliability of Learning Systems” at the Technical University of Munich (TUM).

FRAMOS Makes Next-Generation GMSL3 Accessible for Any Embedded Vision Application

FRAMOS, a global supplier of custom vision solutions and imaging components, is leading the market to integrate Analog Devices’ new GMSL3 technology in the embedded vision environment.

SYSTEM-ON-MODULE SL I.MX6 UL NOW AVAILABLE WITH CODESYS^® SOFTSPS

32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

congatec simplifies Arm deployments with i.MX 8M Plus

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

Upgrading ATE Test Stations with Intepro

Intepro’s upgrade solutions improve workflow and provide value.

TE Connectivity and Phoenix Contact announce joint development agreement for Single Pair Ethernet hybrid cable assemblies

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

Market Overview

Technical Articles

Case studies

Prof. Angela Schoellig has accepted the Infineon Endowed Chair “Safety, Performance and Reliability of Learning Systems” at the Technical University of Munich (TUM).

FRAMOS, a global supplier of custom vision solutions and imaging components, is leading the market to integrate Analog Devices’ new GMSL3 technology in the embedded vision environment.

Diodes Incorporated today announced the introduction of a PCIe® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

Intepro’s upgrade solutions improve workflow and provide value.

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.