21
'22
Written on
IDS Imaging Development Systems GmbH
21
'22
Written on
DMG MORI News
DMG MORI: DIGITAL TWIN, DIGITAL MODEL OF THE REAL OBJECT
The Digital Twin only becomes really valuable through the digital model of the real object and its digital image. Digital models are therefore dynamic 3D representations of a real object that can be used for simulations and analyses.
21
'22
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Trumpf News
TRUMPF and STOPA establish strategic partnership for smart-factory solutions
High-tech company TRUMPF has opened up new opportunities for collaboration with STOPA, one of the leading manufacturers of automated storage systems. The two companies recently announced an agreement to work even closer together in the future.
20
'22
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Meltio News
Meltio Partners With 12 Most Innovative Worldwide Software Companies To Adopt Hybrid And Robotic Additive Manufacturing
This new ecosystem signed with leading software companies to foster the Meltio Engine CNC and Robot Integrations offers its customers the broadest and most compelling software portfolio to industrialize Meltio’s metal additive manufacturing process.
20
'22
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Hainbuch
Dr. Achim Feinauer is CEO at Hainbuch
He started at the workholding technology manufacturer in Marbach in November.
20
'22
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Addup News
AddUp announces the FormUp® 350 Evolution for printing parts up to 1 meter tall
The ability to print large metal parts is in high demand in the aeronautics, space, defense, and energy sectors. AddUp responds to this need with the announcement of a new FormUp® 350 Evolution machine, which will allow for parts up to 1 meter tall to be printed with very high levels of productivity.
20
'22
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IAR Systems News
New partnership between IAR Systems and CAES: NOEL-V support introduced in IAR Embedded Workbench
IAR Systems®, world leader in software and services for embedded development, and Gaisler, the fault-tolerant processor design center of CAES, are pleased to announce the start of a new partnership.
19
'22
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CCLINK News
Industry leader HMS Networks further boosts CC-Link IE TSN development ecosystem
Anybus® CompactCom 40 CC-Link IE TSN adds to the range of development options for device vendors developing CC-Link IE TSN products.
19
'22
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Sysgo News
SYSGO: PikeOS achieves Common Criteria (CC) level EAL5+ Security Certification
SYSGO has responded to the increased cybersecurity threat level: Separation Kernel PikeOS 5.1.3. has attained the most widely accepted security certification standard Common Criteria (CC), also known as ISO 15408, at level EAL 5+ for the leading application processor architectures ARMv8, x86-64 and PPC.
19
'22
Written on
Antaira News
