Moxa, a leading provider of industrial edge connectivity solutions, introduced the new MGate 5119 Series IEC 61850 gateway, which simplifies system integrations and enhances communication security for power substations.
Today, leading 3D printing solutions manufacturer BCN3D has announced a new 3D printing technology to advance alongside its FFF solutions: Viscous Lithography Manufacturing (VLM)TM.
NEXCOM, a leading supplier of network appliances, reveals its new 1U Intel-based rackmount – FTA 5180; delivering high-performance network connectivity. It is a part of the nexCPE product line and is targeted to manage extensive workloads.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
Transfer Multisort Elektronik (TME) continues to expand the variety of applications it is able to address by adding to the range of products available through its distribution network.