ANSYS News

Ansys Inc., founded in 1970 and headquartered in Canonsburg, Pennsylvania, USA, is a global leader in engineering simulation software. The company provides a comprehensive suite of simulation tools that enable engineers and designers to analyze and predict how products will perform in the real world. Ansys' solutions cover areas such as structural analysis, fluid dynamics, electromagnetics, and semiconductor analysis, facilitating innovation across industries including aerospace, automotive, energy, and healthcare. By integrating advanced simulation technologies, Ansys helps organizations accelerate product development, reduce costs, and improve quality.

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14 NOV '24

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Using Ansys' Simulation, WEG Designs Revolutionary Industrial Motor

Ansys technology is instrumental in helping WEG develop an electric industrial motor that enables OEMs to push the limits of innovation through improved efficiency and productivity.

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08 MAY '24

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Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

Collaboration enables accelerated materials discovery to optimize product development.

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21 MAR '24

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ANSYS AND NVIDIA PIONEER NEXT ERA OF COMPUTER-AIDED ENGINEERING

Expanded collaboration will drive the future of simulation powered by accelerated computing and generative AI.

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11 JAN '24

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ANSYS LAUNCHES ANSYS SIMAI™

The new, ultra-fast AI-based addition to the Ansys portfolio enables more virtual testing and creative design.

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26 JUL '23

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ANSYS 2023 R2 POWERS INDUSTRY INNOVATION WITH TRANSFORMATIVE SIMULATION TECHNOLOGIES

The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

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24 JUL '23

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ANSYS HELPS ACCELERATE DEVELOPMENT OF TMYTEK’S NEXT-GEN MMWAVE TECHNOLOGY FOR 5G AND SATELLITE COMMUNICATIONS

Rapid design verification with Ansys simulation accelerates R&D and speeds time to market for TMYTEK’s AiP designs.

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30 JUN '23

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SAMSUNG FOUNDRY CERTIFIES ANSYS THERMAL INTEGRITY AND POWER INTEGRITY SOLUTIONS FOR ITS MULTI-DIE PACKAGING TECHNOLOGIES

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems.

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28 APR '23

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SYNOPSYS, ANSYS AND KEYSIGHT ANNOUNCE NEW MMWAVE REFERENCE FLOW

The 79-GHz mmWave RF design flow for TSMC 16FFC accelerates the development of radio-frequency ICs used in autonomous systems.

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22 APR '23

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ANSYS LAUNCHES ONE-STOP HUB TO STREAMLINE DEVELOPER JOURNEY

The Ansys Developer portal improves the developer experience (DX) through a new platform that offers access to enablement, documentation, and collaboration for Ansys simulation technologies.

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14 APR '23

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AXELERA AI SELECTS ANSYS SIMULATION SOFTWARE FOR EDGE AI PLATFORM CHIP

Ansys' comprehensive power analytics reduce project risk, improve predictive accuracy, and accelerate time to market for Axelera AI’s new Metis AI Platform.

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