www.ptreview.co.uk
30
'23
Written on Modified on
ANSYS News
SAMSUNG FOUNDRY CERTIFIES ANSYS THERMAL INTEGRITY AND POWER INTEGRITY SOLUTIONS FOR ITS MULTI-DIE PACKAGING TECHNOLOGIES
Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems.
Thermal integrity signoff for 3D-IC by Ansys RedHawk-SC Electrothermal
Ansys announced that Samsung Foundry has certified Ansys’ RedHawk power integrity and thermal verification platform for Samsung’s family of heterogeneous multi-die packaging technologies. Samsung’s collaboration with Ansys recognizes the critical importance of power and thermal management on the reliability and performance of advanced side-by-side (2.5D) and 3D integrated circuit (3D-IC) systems.
Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are made possible by 3D-IC technologies, which can also help companies achieve competitive differentiation in their markets. Samsung offers a range of 2.5D packaging options (I-Cube and H-Cube) as well as 3D vertical stacking with X-Cube technology. The dense integration of multiple chips creates a major challenge in heat dissipation. A single die can draw well over 100W of power which must be routed through extremely fine microbump connections.
Samsung has collaborated with Ansys to certify RedHawk-SC Electrothermal for simulating temperature profiles with their packaging technology. Samsung also validated the predictive accuracy of RedHawk-SC Electrothermal with Ansys’ Icepak solution for thermal analysis of electronic assemblies—including forced-air cooling and heat sinks. RedHawk-SC verifies the electromigration (EM) reliability and voltage drop (IR drop) correctness of the entire power distribution network connecting the chiplets and interposer.
Ansys announced that Samsung Foundry has certified Ansys’ RedHawk power integrity and thermal verification platform for Samsung’s family of heterogeneous multi-die packaging technologies. Samsung’s collaboration with Ansys recognizes the critical importance of power and thermal management on the reliability and performance of advanced side-by-side (2.5D) and 3D integrated circuit (3D-IC) systems.
Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are made possible by 3D-IC technologies, which can also help companies achieve competitive differentiation in their markets. Samsung offers a range of 2.5D packaging options (I-Cube and H-Cube) as well as 3D vertical stacking with X-Cube technology. The dense integration of multiple chips creates a major challenge in heat dissipation. A single die can draw well over 100W of power which must be routed through extremely fine microbump connections.
Samsung has collaborated with Ansys to certify RedHawk-SC Electrothermal for simulating temperature profiles with their packaging technology. Samsung also validated the predictive accuracy of RedHawk-SC Electrothermal with Ansys’ Icepak solution for thermal analysis of electronic assemblies—including forced-air cooling and heat sinks. RedHawk-SC verifies the electromigration (EM) reliability and voltage drop (IR drop) correctness of the entire power distribution network connecting the chiplets and interposer.
www.ansys.com
