Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), is adding the proven SMARTCASE chassis kits from Fujitsu to its portfolio and thereby further expanding its product range. Five variants of the Kontron SMARTCASE are currently available: S500, S520, S700, S710 and S720. These serve as the basis for fully assembled Box-PCs, consisting of Kontron motherboards "Designed by Fujitsu", including cooling and housing according to customer specifications. Within the second quarter of 2020, Kontron will launch another SMARTCASE, the S711, for the mITX board D3713-V/R with the AMD Embedded V1000/R1000 series processor. This will enable developers to implement complete systems quickly, easily and without a high level of testing effort. This lowers costs and shortens the time-to-market.
What do the tire pressure of a car and the clamping force of a lathe chuck have in common? Both should be checked regularly to ensure the maximum process safety and efficiency in daily use. The new versatile clamping force tester IFT is designed for this purpose.
The industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Sense Connect Detect (SCD) module from Bosch.
The need for automation in factory and industrial settings will continually increase in the coming years, at the same time as the autonomous driving revolution.
Martin Sion, Chief Executive Officer of Safran Electronics & Defense, and Xavier Barcons, Director General of the European Southern Observatory (ESO), today inaugurated Safran's new production unit at the company's Saint-Benoît plant near Poitiers in central France, which will make the primary mirror segments for Europe's Extremely Large Telescope (ELT).
When it comes to cars that drive themselves, most people are still hesitant. There are similar reservations with respect to onboard sensors gathering data on a driver’s current state of health. As part of the SECREDAS project, a research consortium including the Fraunhofer Institute for Experimental Software Engineering IESE is investigating the safety, security and privacy of these systems. The aim is to boost confidence in such technology.
The latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm® Cortex®-M7 core performance, high memory density, and power savings for future generations of smart objects.
In order process huge components using automated plasma cutting systems down to micrometer accuracy, it is necessary to carry out reliable 3D measurements of these components in advance.