STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is offering a solution to accelerate the market introduction of new Bluetooth® LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module.
TDK Corporation (TSE: 6762) announces the release of Tronics AXO®315, a miniature high performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration.
Siemens Mobility and Siemens Limited India is partnering with Bengaluru Metro Rail Corporation Limited (BMRCL) to implement a comprehensive set of automated train solutions for phase 2 of the Bengaluru metro expansion project.
In Q1 2021, the revolutionary new Zivid Two 3D camera will be available from STEMMER IMAGING. The Zivid Two is a natural successor to the industry-leading Zivid One+ range of cameras.
Commercial partnership under new DARPA Toolbox initiative provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.
PI UK is taking an active part in Talking Industry’s six-part series focusing on Industrial Networks, IIOT and Communications, with the first discussion on Tue Jan 12th, commencing 10:00 UK time.