Fraunhofer-Gesellschaft is expanding its activities in artificial intelligence hardware with the launch of the Chip AI Research and Innovation Center, scheduled to begin operations in 2026 in Heilbronn.

Fraunhofer institutes develop NeurOSmart, integrating LIDAR sensing, embedded AI and neuromorphic chips for energy-efficient, real-time industrial robotics.

Fraunhofer IPMS unveils a compact AI-based hyperspectral camera that enables real-time material and quality analysis for industrial and agricultural applications.

Quantum Saxony, coordinated by leading Saxon research institutions including Fraunhofer IPMS, aims to accelerate the industrial transfer of quantum technologies in computing, communication, materials and sensing.

Fraunhofer, with TSRI, develops FeMFET-based nanosheet memory under 3 nm, enabling in-memory computing for energy-efficient AI chips in smartphones, cars, and medical devices.

Researchers at Forschungszentrum Jülich and QSolid integrated a quantum computer prototype into JUNIQ, marking key progress for Fraunhofer IPMS toward a trustworthy German quantum ecosystem.

Researchers at the Fraunhofer IFF have developed cognitive robot capabilities that can handle complex tasks in manufacturing that were previously impossible to automate.

At Hannover Messe 2025, Fraunhofer presents the AI-based ECC4P control system that offers SMEs secure, tailored solutions.

Fraunhofer will showcase AI for industrial innovation, energy solutions, circular economy, smart systems, and materials efficiency.

Fraunhofer researchers are developing solutions for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling that will help establish an advanced circular economy.