At Hannover Messe 2025, Fraunhofer presents the AI-based ECC4P control system that offers SMEs secure, tailored solutions.

Fraunhofer will showcase AI for industrial innovation, energy solutions, circular economy, smart systems, and materials efficiency.

Fraunhofer researchers are developing solutions for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling that will help establish an advanced circular economy.

In the 3D-InAus project, researchers from Fraunhofer are using a LiDAR laser on a mobile robot, emitting laser pulses to measure distances.

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

At the Hannover Messe 2024, the Fraunhofer Institute for Intelligent Analysis and Information Systems IAIS and the institutes of the Fraunhofer Big Data and Artificial Intelligence Alliance will be presenting two exhibits and several use cases centering on trustworthy AI solutions.

The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.

The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS.

A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.