Thales has successfully completed the first flight of a half-scale prototype of its UAS 100 long-range unmanned air system. Developed in partnership with Issoire Aviation and Hionos, and with the support of the French Ministry of the Armed Forces via the Defence Innovation Agency (AID), UAS100 will help meet demand for more cost-effective drone missions with a lower environmental impact.
At the end of June, the world’s robotics elite squared off at the first virtual “RoboCup” – the Robot World Championships. hftm.team.solidus from Switzerland won the bronze medal in the “Logistics League”. Bystronic has been the team’s main sponsor since 2015. We congratulate them on their success!
BOBST has unveiled a new, multi-purpose version of its EXPERTFOLD 110 folder-gluer offering greater versatility and unrivalled time-saving benefits to packaging converters.
Qeexo, developer of the Qeexo AutoML automated machine-learning (ML) platform that accelerates the development of tinyML models for the Edge, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the availability of ST’s machine-learning core (MLC) sensors on Qeexo AutoML.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, now offers COM-HPC® interconnect solutions from Samtec.
Fast, lightweight and fuel efficient: RACER, the high-speed helicopter reaches flying speeds of up to 400 kilometers per hour. The components of its outer shell are made by an innovative, highly automated manufacturing process. A research team at the Fraunhofer Institute for Casting, Composite and Processing Technology IGCV developed the innovative, sustainable method together with Airbus Helicopters.