Modular Remote I/O Expands Industrial Connectivity

Daudin has expanded the North American availability of its iO-GRID X modular remote I/O platform, providing machine builders, OEMs and automation integrators with a flexible method for connecting field devices to industrial control systems. The platform supports multiple industrial Ethernet protocols and a wide range of modular I/O options, enabling manufacturers to implement smart factory architectures while reducing wiring complexity and control cabinet requirements.

Remote I/O Technology for Industrial Digitalization
As manufacturers pursue digital transformation and Industrial Internet of Things (IIoT) strategies, remote input/output systems have become a key technology for connecting sensors, actuators and monitoring devices to centralized control systems. Rather than requiring extensive point-to-point wiring, remote I/O stations consolidate field connections and communicate through a single network connection and power supply.

This architecture reduces installation labor, lowers material consumption, minimizes control panel footprint and improves system scalability. Applications include discrete manufacturing, machinery, logistics automation, process industries, building automation and material handling systems.

The iO-GRID X platform has been developed as a modular slice-based system that allows users to configure I/O stations according to application requirements while maintaining compatibility with PLCs, industrial controllers and other host devices.

Multi-Protocol Industrial Ethernet Integration
A key feature of the platform is support for multiple industrial Ethernet fieldbus protocols operating at data rates of up to 100 Mbps. Available communication interfaces include EtherCAT, EtherNet/IP, PROFINET, Modbus TCP and CC-Link IE Field Basic.

This broad protocol compatibility enables machine builders and system integrators to deploy a common hardware platform across different automation environments and customer specifications. Each fieldbus coupler incorporates two RJ45 Ethernet ports and an integrated two-port switch, allowing daisy-chain network topologies that simplify installation and network expansion.

Operational status is indicated through integrated LED diagnostics, while firmware updates can be performed using a standard USB Type-C interface. These features support lifecycle maintenance and system upgrades without requiring specialized hardware.

Flexible Modular I/O Architecture
The iO-GRID X family includes more than 20 module types designed to accommodate varying signal requirements and channel densities. Modular construction enables users to combine digital, analog and specialty modules within a single station.

Digital input and output modules are available in 16-channel and 32-channel configurations with both sinking and sourcing options. Connection methods include push-in terminals and 34-pin IDC connectors, allowing users to select wiring methods based on installation requirements.

Analog modules support voltage and current signals with four or eight channels and resolutions ranging from 12 to 16 bits. Higher-resolution analog processing can improve measurement accuracy in applications involving process monitoring, environmental control and machine diagnostics.

Specialized modules include resistance temperature device (RTD) interfaces, thermocouple inputs, serial communication interfaces, high-speed counter modules and pulse output modules. These options allow the platform to support temperature monitoring, motion control, encoder processing and other advanced automation functions.

Industrial Reliability and Maintenance Efficiency
The modules are designed to operate across an ambient temperature range from -10°C to +60°C, supporting deployment in a wide variety of industrial environments. DIN-rail mounting provides both mechanical stability and grounding continuity, while gold-plated spring-loaded interconnection contacts ensure reliable communication between adjacent modules.

The platform is powered using standard 24 VDC supplies and is available with two power supply configurations to support different station sizes and I/O densities. All models carry CE and UL certifications, supporting deployment in international and North American industrial markets.

Maintenance considerations have also been incorporated into the design. Detachable terminal blocks allow modules to be replaced without disconnecting field wiring, reducing downtime during service activities. Push-in wiring technology eliminates the need for tools during installation, while IDC connectors provide high-density wiring options for applications with larger channel counts.

Supporting Smart Factory Infrastructure
The increasing adoption of connected manufacturing environments requires automation hardware capable of integrating diverse devices while remaining adaptable to future requirements. By combining multi-protocol communication support with configurable modular I/O architecture, the platform is intended to simplify the deployment of digital supply chain and industrial automation systems.

Daudin also offers customization services covering hardware, firmware, software, labeling and application-specific development. These capabilities allow machine builders and system integrators to tailor remote I/O solutions to specialized operational requirements while maintaining compatibility with broader industrial control architectures.

Additional Context: This section details technical specifications and competitive benchmarking not included in the original product announcement
The modular remote I/O market includes solutions from manufacturers such as Siemens, Beckhoff, Phoenix Contact, WAGO, Advantech and Turck. Common evaluation criteria include protocol support, channel density, environmental ratings, modular scalability, diagnostic capabilities and ease of maintenance.

Comparable platforms include Siemens ET 200SP, Beckhoff EtherCAT Terminal systems, WAGO I/O System 750 and Phoenix Contact Axioline I/O. These systems typically support multiple industrial Ethernet protocols and modular expansion architectures similar to those implemented in the iO-GRID X platform.

The support for EtherCAT, EtherNet/IP, PROFINET, Modbus TCP and CC-Link IE Field Basic within a single product family is notable because it enables OEMs to standardize hardware across multiple regional and customer-specific automation environments. The availability of more than 20 I/O module types also positions the platform competitively within the modular automation sector.

Current industry trends emphasize decentralized control architectures, Industrial IoT connectivity and edge-level data acquisition. Remote I/O platforms capable of supporting multiple communication standards and rapid field expansion are increasingly used as foundational infrastructure for smart manufacturing and connected industrial operations.

Edited by Sucithra Mani, Induportals editor – adapted by AI.

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