Integrated Electronics Manufacturing Systems at APEX EXPO 2026

At APEX EXPO 2026 in Anaheim, ASMPT SMT Solutions, ASMPT Semiconductor Solutions, and Critical Manufacturing will jointly demonstrate integrated manufacturing systems covering surface-mount assembly, advanced packaging, and manufacturing execution software for electronics production.

Context of the Cooperation
The cooperation will bring together three business units within the ASMPT Group with complementary roles in electronics manufacturing. ASMPT SMT Solutions will focus on surface-mount technology (SMT) equipment such as placement systems, solder paste printers, and inspection tools. ASMPT Semiconductor Solutions will contribute equipment for semiconductor backend and advanced packaging processes, including high-performance bonding systems. Critical Manufacturing, an ASMPT software subsidiary, will provide manufacturing execution systems (MES) designed for complex, high-mix electronics production environments.

The joint presentation will address the increasing integration of SMT assembly, advanced packaging, and digital production control required in applications such as automotive electronics, industrial systems, IT infrastructure, and semiconductor-enabled products.

Technical Solution and Responsibilities
ASMPT SMT Solutions will present placement platforms, printing systems, and inspection equipment designed for high-throughput and high-precision PCB assembly. The SIPLACE V placement platform will support components ranging from 016008M chips to large or odd-shaped components and will offer up to 90 feeder slots within a compact footprint of approximately 1.1 × 2.4 meters. Gigabit Ethernet connectivity will enable data exchange with upstream and downstream systems.

Printing solutions will include the DEK TQ L and DEK TQ XL solder paste printers. The DEK TQ XL will support PCBs up to 850 × 610 mm, with thicknesses of up to 8 mm and weights of up to 12 kg, while maintaining print consistency on boards with warpage of up to 4 mm.

ASMPT Semiconductor Solutions will complement SMT assembly with bonding and advanced packaging equipment designed to address higher integration densities and tighter quality requirements. Critical Manufacturing will provide the MES layer, enabling end-to-end production control, data traceability, and integration across SMT, packaging, and inspection processes.

Deployment and System Integration
The systems will be shown as a complete production line integrating placement, printing, and solder paste inspection, supported by software platforms including ASMPT’s WORKS Software Suite, Factory Equipment Center, and SMT Analytics. These systems will exchange process data for monitoring, maintenance planning, and analysis. The MES platform from Critical Manufacturing will connect shop-floor equipment with production planning and quality management systems using standard interfaces.

Applications and Expected Impact
Target applications will include consumer electronics, automotive electronics, industrial control systems, and semiconductor-enabled assemblies. The combined approach will support higher line utilization, improved process stability, and increased transparency across manufacturing stages. Performance gains, such as placement throughput improvements of up to 30 percent under operating conditions, will be achieved through platform-level mechanical design, data-driven optimization, and coordinated software integration rather than isolated equipment upgrades.

By presenting these systems together, the cooperation will illustrate how integrated hardware and software architectures can address scalability, complexity, and quality requirements in modern electronics manufacturing without fundamental changes to existing production lines.

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