digid GmbH Simplifies Nanosensor Integration
End-to-end engineering support enables plug-and-play deployment of nanoscale sensors in industrial systems.
www.digid.com
digid GmbH has introduced a comprehensive end-to-end engineering and integration support service aimed at simplifying the deployment of nanoscale sensors in industrial and embedded applications.
Announced at Embedded World 2026, the initiative helps hardware developers integrate ultra-small sensors into mechanical components and electronic systems by providing full design, simulation and assembly support.
Overcoming integration barriers
While digid is known for producing ultra-miniaturized printed force and temperature sensors at the nanometre scale, the company identified integration as the biggest barrier preventing wider adoption.
Connecting and routing signals from microscopic sensors can be technically challenging for engineers designing new hardware. To address this, digid offers a customized engineering workflow that manages the entire integration process.
Customers can submit mechanical components or CAD files, after which digid performs:
- Finite Element Method (FEM) simulations
- Sensor placement and deposition
- Electrical signal routing
- Integration into a usable electronic interface
The goal is to deliver a fully integrated, plug-and-play sensing solution rather than a standalone component.
Simulation-driven sensor design
The integration process is supported through collaboration with Ansys, enabling advanced simulation tools to optimize sensor placement and performance before production.
Sensors can either be deposited directly onto a customer’s mechanical component or delivered as a sub-assembly module ready for integration into manufacturing systems.
In one integration method, thin-film electrodes are deposited directly onto a mechanical part and connected through wire bonding to a flexible PCB, which terminates with standard connectors for conventional electronics interfaces.
Applications in robotics and automation
digid’s nanoscale sensors are suited for applications where traditional sensors are too large or slow.
In robotic handling systems, the company’s force sensors can be deposited directly onto gripping surfaces, enabling precise force feedback without altering the physical shape of the component.
In high-speed automated machinery, sensors can be integrated into existing production equipment to detect contact events, blockages or contamination in real time, improving monitoring accuracy compared to indirect vibration-based detection.
Advanced thermal monitoring
The technology also enables direct temperature sensing on microelectronics, including power devices, semiconductor chips and battery cells.
Embedding nanoscale sensors directly on component surfaces allows instantaneous temperature monitoring, eliminating the thermal lag often associated with conventional thermocouples or probes.
Visitors to Embedded World 2026 in Nuremberg can see demonstrations of digid’s integrated nanoscale sensing solutions at Hall 3A, Booth 627.
Edited by an industrial journalist, Lekshman Ramdas.
www.digid.com
