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Leoni News

More stable and leaner: Leoni synchronises product and process development with its Innovation Industrialization Center (IIC)

As of now, researchers, engineers and production specialists at Leoni will be closely linked in creating the wiring system of the future – at the Innovation Industrialization Center (IIC) in the Franconian town of Kitzingen. With this think tank, the Company will be strengthening its position as an innovation partner to the automotive industry.

B&R News

Free choice of simulation tool

B&R has added a new function to its Automation Studio development environment. With FMU Export, machine code can be exported and integrated as a PLC simulation into any simulation tool, allowing simulation experts to work in the familiar software ecosystem of their choice. This saves both valuable time and resources during interdisciplinary development.

Stratasys News

STRATASYS INTRODUCES FDM CERTIFICATION PROGRAM

Stratasys has announced a new certification program for Stratasys FDM® 3D printer operators and engineers, the first in a series of certification programs for Stratasys 3D printer users. The program is designed to provide Stratasys customers with a comprehensive education that supports their adoption of 3D printing through the entire FDM printing process.

Baslerweb News

Basler Announces Vision Compatibility for New NVIDIA Jetson Orin Nano Edge AI Platform

Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.

Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

ARROW News

Arrow Electronics demonstrates advanced machine vision development capabilities at VISION show

Arrow Electronics will be exhibiting at VISION, the world’s leading trade fair for machine vision, in Stuttgart (hall 8, booth C-33). The company will showcase a range of technologies, building blocks, and support services that help accelerate the development of embedded systems essential for machine vision applications.

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