BV Elektronik, an Avnet company, will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany. The distributor is using the event to demonstrate its expertise across a dozen dedicated workstations that integrate content from a total of 19 different suppliers and partners.
Alps Alpine Europe GmbH, one of the world’s largest developers and manufacturers of electromechanical devices, celebrate the supply of 1 million Lykaner® long-lifetime asset trackers with Heliot Group, Sigfox 0G Operator in Germany, Austria, Switzerland and Slovenia, and UnaBiz, a major IoT service provider and new owner of the Sigfox 0G technology.
The combination of Visual Components manufacturing simulation and NVIDIA's state-of-the-art computing knowledge results in a powerful solution for the digitalization of the manufacturing industry.
Infineon Technologies AG today announced plans to highlight how it links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and homes, smart factories and smart mobility, along with its latest software and tools for system builders and makers working across the electronics industry.
With the new weight-reduced layer gripper from Schmalz, cobots can also palletize lighter workpiece layers. It is not only slim, but also efficient: Schmalz optimally matches the suction grid, gripper dimensions and all other components to the handling task, thus minimizing the power required for vacuum generation.
Telit, a global enabler of the Internet of Things (IoT), today announced that its award-winning Telit deviceWISE platform now includes new digital transformation applications and templates enabling out-of-the-box solutions for industrial companies.
Schneider Electric, the leader in the digital transformation of energy management and automation, today announced a collaboration with Intel to extend EcoStruxure Automation Expert by creating a Distributed Control Node (DCN) software framework complimented by an associated Intel processor-based DCN hardware offering.
The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.
Companies looking for an OEM fabricator that can provide industry-leading quality need look no further than Wisconsin based Robinson, Inc. A leader in manufacturing, Robinson’s highly trained workforce is equipped to serve as an OEM fabricator for a wide range of industries.