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27
'23
Written on Modified on
ANSYS News
NEW ANSYS 2023 RELEASE AMPLIFIES PRODUCT DESIGN AND ENGINEERING SUCCESS FOR CUSTOMERS ACROSS INDUSTRIES
With the newly launched Ansys 2023 R1, engineers can simulate more complex products faster than ever via new cloud options and optimized use of multiple graphics processing units (GPUs).
Ansys 2023 R1 includes updates to Ansys Fluent (pictured), featuring the full release of the multi-GPU solver for a broad spectrum of applications
The software and service improvements in Ansys 2023 R1 concentrate and amplify the incredible advantages that engineering simulation provides to multidisciplinary engineering and R&D teams. Ansys 2023 R1 enables organizations to accelerate past complexity and integration challenges to design the next generation of world-changing products by taking advantage of performance improvements, cross-discipline workflow integrations, and innovative capabilities.
Enhance Simulation Performance
The Structures product collection delivers new features and capabilities that allow users to perform more predictively accurate, efficient, and customizable simulation analyses.
The full release of the multi-GPU solver in Ansys® Fluent® computational fluid dynamics (CFD) software unleashes the power of multiple GPUs for a broad spectrum of applications — substantially reducing solve time and total power consumption.
Ansys Gateway powered by AWS enables developers, designers, and engineers to manage their complete Ansys simulation and computer-aided design engineering (CAD/CAE) projects from anywhere on virtually any device via a web browser.
Integrate and Automate Workflows
Ansys 2023 R1 also builds on the capabilities of materials, simulation process and data management (SPDM), optimization, and MBSE to improve engineering efficiency by supporting intelligent workflow automation and collaboration. The Ansys Connect product collection boasts user experience improvements, new integrations, and ease-of-use features to connect the latest processes, tools, and data more readily for different engineering teams.
Engineers can boost efficiency faster with “one-click” Ansys® optiSLang™ optimization of simulation toolchains to perform design studies that enable engineers to quickly explore optimal designs. Those same optimization algorithms run trade studies for MBSE in Ansys ModelCenter.
Innovate Across the Product Development Process
In semiconductors, Ansys continues to deliver 3D-IC multiphysics leadership with Ansys® RedHawk-SC™ and RedHawk-SC Electrothermal included in TSMC’s 3Dblox™ Reference Flow for power integrity, signal integrity, and thermal reliability signoff. A new thermal analysis methodology for RedHawk-SC Electrothermal uses half as much memory so that complex designs can be handled more efficiently.
Ansys® Granta™ features material eco-data and tools that are now available on the cloud, which help optimize material selection for more cost-effective, sustainable products.
In the Ansys Electronics collection, users can accelerate finite-sized antenna array simulations by adapting individual 3D component cells in parallel. This remarkable technology is unmatched in the industry and will empower organizations designing antennas for satellite communications, automotive radar, and aerospace applications.
www.ansys.comThe software and service improvements in Ansys 2023 R1 concentrate and amplify the incredible advantages that engineering simulation provides to multidisciplinary engineering and R&D teams. Ansys 2023 R1 enables organizations to accelerate past complexity and integration challenges to design the next generation of world-changing products by taking advantage of performance improvements, cross-discipline workflow integrations, and innovative capabilities.
Enhance Simulation Performance
The Structures product collection delivers new features and capabilities that allow users to perform more predictively accurate, efficient, and customizable simulation analyses.
The full release of the multi-GPU solver in Ansys® Fluent® computational fluid dynamics (CFD) software unleashes the power of multiple GPUs for a broad spectrum of applications — substantially reducing solve time and total power consumption.
Ansys Gateway powered by AWS enables developers, designers, and engineers to manage their complete Ansys simulation and computer-aided design engineering (CAD/CAE) projects from anywhere on virtually any device via a web browser.
Integrate and Automate Workflows
Ansys 2023 R1 also builds on the capabilities of materials, simulation process and data management (SPDM), optimization, and MBSE to improve engineering efficiency by supporting intelligent workflow automation and collaboration. The Ansys Connect product collection boasts user experience improvements, new integrations, and ease-of-use features to connect the latest processes, tools, and data more readily for different engineering teams.
Engineers can boost efficiency faster with “one-click” Ansys® optiSLang™ optimization of simulation toolchains to perform design studies that enable engineers to quickly explore optimal designs. Those same optimization algorithms run trade studies for MBSE in Ansys ModelCenter.
Innovate Across the Product Development Process
In semiconductors, Ansys continues to deliver 3D-IC multiphysics leadership with Ansys® RedHawk-SC™ and RedHawk-SC Electrothermal included in TSMC’s 3Dblox™ Reference Flow for power integrity, signal integrity, and thermal reliability signoff. A new thermal analysis methodology for RedHawk-SC Electrothermal uses half as much memory so that complex designs can be handled more efficiently.
Ansys® Granta™ features material eco-data and tools that are now available on the cloud, which help optimize material selection for more cost-effective, sustainable products.
In the Ansys Electronics collection, users can accelerate finite-sized antenna array simulations by adapting individual 3D component cells in parallel. This remarkable technology is unmatched in the industry and will empower organizations designing antennas for satellite communications, automotive radar, and aerospace applications.
