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MICRO EPSILON News

Thickness and structure measurement of solar wafers with MICRO EPSILON

The production of solar wafers starts with the raw wafers that are sawn from the so-called ingots. These must comply with a specified thickness of about 180 µm to be processed further as a good part.

SCHUNK News

SCHUNK: AUTOMATION THAT WORKS

SCHUNK offers a comprehensive portfolio with all the necessary components, and also the experience and know-how for efficient automation solutions for any requirement.

Hexagon Manufacturing Intelligence News

THE FOUR BUILDING BLOCKS OF THE INDUSTRIAL METAVERSE

Stephen Graham, Executive Vice President and General Manager, Nexus, Hexagon, introduces us to the 4 building blocks of the industrial metaverse, highlighting some of the key issues.

Rohm Semiconductors News

ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.

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