Johannes van der Beek brings a wealth of experience from the End-of-Line packaging sector and holds a Dr.-Ing. degree in Mechanical Engineering from RWTH University in Aachen.
Siemens introduces the SIRIUS 3RC7 intelligent link module, enhancing data transparency and operational efficiency in industrial automation by integrating IT and OT.
Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.
Nabtesco Precision Europe will showcase its innovative cycloidal and strain wave gears for automation at SPS 2024, featuring live demonstrations and expert insights into dynamic motion solutions.
The system integrates solenoid interlocks and safety sensors from Schmersal, as well as fail-safe actuators. An IO-Link safety master and an IO-Link safety hub from Schmersal will also be part of the system in future.
Powered by Intel Xeon D Series, Intel Xeon Scalable processors, & AMD EPYC processors, Vecow’s new edge AI server platforms offer features tailored to the evolving needs from AI inference to large-scale IT deployments.
MVTec introduces MERLIC 5.6 at SPS 2024, offering enhanced automation with new deep learning tools and PLC connectivity, revolutionizing factory production efficiency.
This partnership follows ANDRITZ’s development of the world’s fastest, most productive welding machine for welding one bipolar plate per second (1 Hz), matching the throughput of the Cell Impact forming process.