Time-Sensitive Networking (TSN) is a unique, innovative technology that can help companies implement futureproof Industry 4.0 applications by considerably improving industrial Ethernet standards. By means of key additions to these standards, TSN supports determinism and network convergence – two essential elements of highly competitive, connected industries of the future.
ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today launches the 4LS series, adding new faster and higher resolution line scan image sensors to its broad family of sensors for machine-vision applications.
Probably the world's smallest embedded vision system – fully integrated in one board and hardly bigger than an image sensor module: VC picoSmart from Vision Components will premiere at embedded world 2021 DIGITAL (March 1–5).
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the new Sterling-LWB5+ modules from Laird Connectivity. The modules deliver Wi-Fi 5 (802.11ac) and Bluetooth® 5.1 communications to next-generation Internet of Things (IoT) devices such as battery-powered medical devices, industrial IoT sensors, rugged handheld devices, and other connectivity solutions.
Promobot is a service robot that will now assist UAE entrepreneurs in their business. It starts operation at a business center in the Ajman emirate. Promobot service robot operates in Ajman’s free-trade zone, similarly to civil service offices of Canada, Russia, etc.
The name of the US company Great Lakes Custom Tool Manufacturing (GLCT) says it all: GLCT produces special tools and is situated at Lake Michigan, one of North America's five Great Lakes. In order to machine tools and circular saws that are tipped with carbide or PCD (polycrystalline diamond), the toolmaker uses 19 VOLLMER machines in total. Recently, the Swabian sharpening specialist supplied GLCT with a VPulse 500 wire erosion machine and a VGrind 360 tool grinding machine, amongst others.
Semiconductor demand has grown continually in recent years due to the rapid development of new technologies such as artificial intelligence (AI), 5G broadband networks, and Internet of Things (IoT). Equipment manufacturers have gradually stepped up investment in the development of new models to cope with the formidable challenges posed by high-precision advanced manufacturing processes. Key process equipment for semiconductor manufacturing includes dual wafer stages for photolithography, wafer bonding equipment, advanced laser annealing equipment, and equipment front-end modules (EFEMs).