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Case studies

How ACE and KeyTec Facilitate Ergonomics and Manpower of Tooling Machines

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21  '21
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Volkswagen News

Volkswagen plans to use new 3D printing process in vehicle production in the years ahead

Volkswagen is pressing ahead with the use of innovative 3D printers in car production. For the first time, the newest process – known as binder jetting – is being used to manufacture components at the company’s main plant in Wolfsburg, Germany. Whereas conventional 3D printing uses a laser to build a component layer by layer from metallic powder, the binder jetting process uses an adhesive. The resulting metallic component is then heated and shaped.

21  '21
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Kuka News

Alexander Tan new CFO of KUKA AG

At an extraordinary meeting, the KUKA Supervisory Board appointed Alexander Tan as a member of the Management Board.

19  '21
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Krones News

NEW SOFTWARE RELEASE 4.0 FOR THE BOTEC F1 PROCESS CONTROL SYSTEM

The Botec process control system has been successfully used on the market for 27 years now. Originally conceived by the Steinecker company as a control and visualisation system for breweries, the system has been purposefully expanded in order to also meet the needs of other food and beverage makers. An approach validated by its success, as the steadily growing demand from dairies, water and soft-drinks producers goes to show. That is hardly surprising since it must be in every company’s vital interest to ensure that its lines deliver dependable service in keeping with their dimensioning at all times, that production sequences are simple, fast and transparent while also ensuring minimised consumption of raw materials and energy.

19  '21
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ST News

STMicroelectronics Helps Lierda Develop Low-Power Bluetooth Module for Wireless Solutions

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that a new low-power Bluetooth module from Lierda Science & Technology Group Co. Ltd, a hi-tech enterprise that provides IoT system and smart product solutions in China, uses an ST STM32WB55* Bluetooth® LE (BLE) microcontroller (MCU).

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