06
'22
Written on
Actemium News
06
'22
Written on
BOBST News
BOBST Inkjet Printing: A printing cluster changing label production
"Compact, reliable, connected, upgradable, green. Those would be my priorities in any technology these days". Article by Stelios Manousakis, Digital Technology Director at BOBST. And the more high-tech you go, the more these criteria have to be made a reality – indeed, they are practically inseparable from each other, and the foundation for successful and sustainable innovations.
06
'22
Written on
Regloplas
Expansion of the REGLOPLAS jetPulse series with jetPulse 100L and flowControl - Efficient cooling of demanding die-cast components with hotspots
Demanding die-cast components, such as structural components in the automotive sector (megacastings), place special requirements on the temperature control, in particular on the cooling of so-called hotspots. The jetPulse system from REGLOPLAS offers a reliable and economical solution for cooling hotspots in a die casting die with pinpoint accuracy and reliability.
04
'22
Written on
Voith News
WITH ONQUALITY 4.0, VOITH SETS NEW STANDARDS IN THE FIELD OF QUALITY CONTROL SYSTEMS
OnQuality 4.0 increases data transparency, enhances quality measurements, optimizes control strategies and thus leads to significant cost savings. Analyses, dashboards and reports can be created with a few clicks and accessed on smartphones and tablets.
03
'22
Written on
Binder News
Designed for power applications in North America
Use in control cabinets for the North-American market requires specific testing and certification of the components. In the case of power applications, they are subject to the UL 2237 standard. binder's 823 and 824 series of compact cable connectors have been developed according to this standard.
03
'22
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Intel News
Intel RealSense Depth Camera D435f
New Infrared Pass Filters for Better Range Performance. The Intel RealSense Depth Camera D435f addresses challenges for autonomous mobile robots.
03
'22
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MAPLESOFT News
New MapleSim release from Maplesoft provides an enhanced multidomain modeling tool that helps designers build better machines
Maplesoft today announced a new release of MapleSim that makes it even easier for engineers to improve the design of machines that incorporate elements from multiple engineering domains. MapleSim is an advanced modeling and simulation tool that helps machine designers reduce development time, lower costs, and diagnose real-world performance issues, with its flexible modeling environment, built-in analysis tools, and connectivity to automation systems.
03
'22
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Rutronik Info
Design flexibility for smart applications
The iVativ RENO module is based on the Nordic nRF52840 SoC and supports Bluetooth 5.0, Thread/ZigBee/ANT and NFC-A is now available at Rutronik. It is suitable for smart home applications, asset trackers and location devices, smart fitness devices, healthcare systems, IIoT sensors and control, and mobile payments.
03
'22
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Texas Instruments News
New processors make edge AI more accessible while cutting power consumption in half
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
03
'22
Written on
TWK News
