18 {{ "2023-12-18T00:00:00+00:00" | date "MMM" }} '23

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Congatec News

Next-generation AI computing for the edge

Congatec is introducing its latest COM Express Compact modules, powered by Intel^® Core™ Ultra processors, which offer a unique combination of CPU, GPU, and NPU, making them ideal for running demanding AI workloads at the edge.

Read more…

18 {{ "2023-12-18T00:00:00+00:00" | date "MMM" }} '23

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ABB News

ABB ROBOTICS PARTNERS WITH XTALPI TO BUILD INTELLIGENT AUTOMATED LABORATORIES

Over one hundred ABB GoF collaborative robots automate laboratory workstations, accelerating R&D in the chemical and life sciences sectors.

Read more…

15 {{ "2023-12-15T00:00:00+00:00" | date "MMM" }} '23

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Beckhoff News

Beckhoff Entering 2024 with an air of optimism

Over the past year and a half, supply chain challenges have been significant, with lead times for advanced components like drives, PLCs, and HMIs often exceeding 52 weeks. However, improvements in lead times and inventory levels have been observed.

Read more…

15 {{ "2023-12-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-15T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens Xcelerator: AI integrated in Mecalux’s new picking robots boosts efficiency

Mecalux warehouse management systems, and stacker cranes, and the technology company Siemens have combined their expertise and experience in the field of industrial automation technologies.

Read more…

14 {{ "2023-12-14T00:00:00+00:00" | date "MMM" }} '23

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Flexxbotics News

Flexxbotics Announces Robot Compatibility with HURCO^® CNC Machines & Automation Solutions

Flexxbotics, has announced robot machine tending connectivity compatible with the full line of HURCO machinery including 5-axis machining centers, 3-axis machining centers, portal machining centers, horizontal machining centers, and turning centers.

Read more…

14 {{ "2023-12-14T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-14T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

CEA-Leti at IEDM 2023 has described the world’s-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.

Read more…

14 {{ "2023-12-14T00:00:00+00:00" | date "MMM" }} '23

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SICK News

SICK’S NEXT-GENERATION DT80 DISTANCE SENSOR SETS PRECISION STANDARD

With the launch of its next-generation DT80 distance sensor, SICK has revised the standard for measurement precision in countless industrial applications in a compact and robust device.

Read more…

14 {{ "2023-12-14T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-14T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS FACTORY AUTOMATION

PEPPERL+FUCHS: Inclination Values That Are Always Reliable

The IMU F99 inclination sensor offers stable inclination values for mobile use on construction machinery or robots, with an integrated gyroscope compensating for accelerations, making it a superior choice over static sensors.

Read more…

13 {{ "2023-12-13T00:00:00+00:00" | date "MMM" }} '23

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Melexis News

Melexis squeezes ultimate performance in a tiny 3D Magnetometer

Melexis announces the MLX90394 Triaxis^® micropower magnetometer, a tiny Hall-effect based sensor. It perfectly balances the design trade-off between low noise, current consumption and cost.

Read more…

12 {{ "2023-12-12T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-12T00:00:00+00:00" | date "longDate" }}

TDK News

TDK TO SHOWCASE CUTTING-EDGE TECHNOLOGY AT CES 2024

Exhibiting at CES 2024, TDK will demonstrate its component and system solution portfolio in Central Hall - booth #20521.

Read more…

Case studies

How ACE and KeyTec Facilitate Ergonomics and Manpower of Tooling Machines

Next-generation AI computing for the edge

Congatec is introducing its latest COM Express Compact modules, powered by Intel^® Core™ Ultra processors, which offer a unique combination of CPU, GPU, and NPU, making them ideal for running demanding AI workloads at the edge.

ABB ROBOTICS PARTNERS WITH XTALPI TO BUILD INTELLIGENT AUTOMATED LABORATORIES

Over one hundred ABB GoF collaborative robots automate laboratory workstations, accelerating R&D in the chemical and life sciences sectors.

Beckhoff Entering 2024 with an air of optimism

Over the past year and a half, supply chain challenges have been significant, with lead times for advanced components like drives, PLCs, and HMIs often exceeding 52 weeks. However, improvements in lead times and inventory levels have been observed.

Siemens Xcelerator: AI integrated in Mecalux’s new picking robots boosts efficiency

Mecalux warehouse management systems, and stacker cranes, and the technology company Siemens have combined their expertise and experience in the field of industrial automation technologies.

Flexxbotics Announces Robot Compatibility with HURCO^® CNC Machines & Automation Solutions

Flexxbotics, has announced robot machine tending connectivity compatible with the full line of HURCO machinery including 5-axis machining centers, 3-axis machining centers, portal machining centers, horizontal machining centers, and turning centers.

CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

CEA-Leti at IEDM 2023 has described the world’s-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.

SICK’S NEXT-GENERATION DT80 DISTANCE SENSOR SETS PRECISION STANDARD

With the launch of its next-generation DT80 distance sensor, SICK has revised the standard for measurement precision in countless industrial applications in a compact and robust device.

PEPPERL+FUCHS: Inclination Values That Are Always Reliable

The IMU F99 inclination sensor offers stable inclination values for mobile use on construction machinery or robots, with an integrated gyroscope compensating for accelerations, making it a superior choice over static sensors.

Melexis squeezes ultimate performance in a tiny 3D Magnetometer

Melexis announces the MLX90394 Triaxis^® micropower magnetometer, a tiny Hall-effect based sensor. It perfectly balances the design trade-off between low noise, current consumption and cost.

TDK TO SHOWCASE CUTTING-EDGE TECHNOLOGY AT CES 2024

Exhibiting at CES 2024, TDK will demonstrate its component and system solution portfolio in Central Hall - booth #20521.

Case studies

Congatec is introducing its latest COM Express Compact modules, powered by Intel® Core™ Ultra processors, which offer a unique combination of CPU, GPU, and NPU, making them ideal for running demanding AI workloads at the edge.

Over one hundred ABB GoF collaborative robots automate laboratory workstations, accelerating R&D in the chemical and life sciences sectors.

Over the past year and a half, supply chain challenges have been significant, with lead times for advanced components like drives, PLCs, and HMIs often exceeding 52 weeks. However, improvements in lead times and inventory levels have been observed.

Mecalux warehouse management systems, and stacker cranes, and the technology company Siemens have combined their expertise and experience in the field of industrial automation technologies.

Flexxbotics, has announced robot machine tending connectivity compatible with the full line of HURCO machinery including 5-axis machining centers, 3-axis machining centers, portal machining centers, horizontal machining centers, and turning centers.

CEA-Leti at IEDM 2023 has described the world’s-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.

With the launch of its next-generation DT80 distance sensor, SICK has revised the standard for measurement precision in countless industrial applications in a compact and robust device.

The IMU F99 inclination sensor offers stable inclination values for mobile use on construction machinery or robots, with an integrated gyroscope compensating for accelerations, making it a superior choice over static sensors.

Melexis announces the MLX90394 Triaxis® micropower magnetometer, a tiny Hall-effect based sensor. It perfectly balances the design trade-off between low noise, current consumption and cost.

Exhibiting at CES 2024, TDK will demonstrate its component and system solution portfolio in Central Hall - booth #20521.

Congatec is introducing its latest COM Express Compact modules, powered by Intel^® Core™ Ultra processors, which offer a unique combination of CPU, GPU, and NPU, making them ideal for running demanding AI workloads at the edge.

Melexis announces the MLX90394 Triaxis^® micropower magnetometer, a tiny Hall-effect based sensor. It perfectly balances the design trade-off between low noise, current consumption and cost.