Nexcom's new XPPC xx-10N97 balances power & performance for logistics & self-service applications

In the age of digital transformation, choosing from the abundance of industrial computing options can be overwhelming, as the best fit needs to address as many business pain points as possible. Faster processing speeds, lower power usage, adaptability, and durability are all essential benefits, among many others, that companies hope to capture when choosing industrial solutions. In recent years, an edge computing system has proven to be one of the best solutions to offer intangible benefits on top of cutting-edge features for any industrial application.

NEXCOM, as a leader in industrial computing, has built its reputation on developing diversified edge computing systems for clients’ distinct needs. In response to the burgeoning logistics industry’s recent requests, it has adapted its top-notch XPPC touch computer series for the logistics and self-service industries. With an enhanced design and less power utilization, the XPPC 16-10N97 and XPPC 10-10N97 have arrived.

What exactly is the XPPC xx-10N97?
The XPPC xx-10N97 is an embedded, slim-bezel, fanless panel PC available in two sizes, 15.6” (XPPC 16-10N97) and 10.1” (XPPC 10-10N97), to adapt to the space constraints of disparate industrial environments. The improved external design includes specific mechanical features that increase durability, visibility, and cleanliness. Intel^® SoC hardware balances performance and power efficiency while the customized and QA-validated internal design provides the longevity and reliability necessary for logistics and self-service applications: logistics and warehouse management equipment, parking systems, reverse vending machines – and many more.

Impressive external design
To begin with, the FHD panel uses optical bonding for improved visibility. Combined with AF (anti-fingerprint) coating, the XPPC xx-10N97 delivers more durability and touch sensitivity, especially critical for fast-moving logistics environments subject to bumps and scratches. The front-side IP65 rating assures workers that the front panel is protected against damage from dust and low-pressure water jets. Lastly, loyal XPPC-series users will be pleased to know that the new XPPC xx-10N97’s diverse mounting system is backward compatible with previous models’ VESA, panel, and open mounting.

Noteworthy SoC with multi-connectivity
In targeting the XPPC xx-10N97 for low-power and embedded computing applications, NEXCOM specifically selected Intel^® N97 SoC processor. It offers an indispensable combination of performance and power efficiency, suitable for compact and fanless systems. It even affords higher performance than 11th-generation Core i3 CPUs, meaning that bigger is not always better. The cost-effective SoC also includes Intel^® UHD graphics and multi-connectivity options, such as M.2 2242 M key and mini-PCIe slots for 4G/LTE and WiFi/BT expansion options, HDMI^® 2.0b to extend to a second display, and line out and optional COM port (RS232/422/485) interfaces.

Long-lasting and reliable internal design
The fanless panel PC is notable for its extreme stability and longevity through a fanless and customized embedded board design and rigorous internal validation process. First, the fanless design reduces failure from certain mechanical issues while improving heat dissipation. It also lessens the risk of dust contamination, coupled with its IP65 protection. Secondly, the customized design saves space for the most necessary components while ensuring overall system reliability. Finally, the XPPC xx-10N97 endured a comprehensive QA validation process that includes EMI/EMC validation and third-party design-quality approval to ensure the touch computer imparts thermal dissipation and protection against shock and vibration.

Main Features

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