INTEL, ERICSSON EXPAND COLLABORATION TO ADVANCE NEXT-GEN OPTIMIZED 5G INFRASTRUCTURE

Intel announced a strategic collaboration agreement with Ericsson to utilize Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.

The companies will also expand their collaboration to optimize 4th Gen Intel^® Xeon^® Scalable processors with Intel^® vRAN Boost for Ericsson’s Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.

18A is Intel's most advanced node on the company's five-nodes-in-four-years roadmap. After new gate-all-around transistor architecture – known as RibbonFET – and backside power delivery – called PowerVia – appear first in Intel 20A, Intel will deliver ribbon architecture innovation and increased performance along with continued metal linewidth reduction in 18A. Combined, these technologies will put Intel back in the process leadership position in 2025, elevating future offerings its customers bring to market.

The future is open and scalable
As 5G deployments continue, the future lies in fully programmable, open software-defined networks powered by the same cloud-native technologies that transformed the data centre, delivering unparalleled agility and automation.

To realize the best performance, innovation and global scale, the industry needs to work together and continue to synchronize network specifications as part of one global set of standards. Intel and Ericsson collaborate with other leading technology companies to bring these benefits to their customers toward industry-scale open RAN.