Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces

Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.

Specially designed for use with extremely thin end effectors, it features an extremely controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

Based on photoelectric Micromote technology, it features the smallest LED sensor on the market in an impressively small sensor head – measuring in at just 2.4 x 1.5 x 7 mm. This allows it to deliver precision in even the smallest spaces.

In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as Life Science and Food and Beverage applications.

Key features:

• Multi-functional sensor head
• Smallest LED sensor on the market
• Very compact, extremely flexible sensor cable
• Flexible adaptation to the respective application using an external amplifier

www.balluff.com

  Ask For More Information…