Kontron Highlights Edge AI and CRA-Ready Platforms at Embedded World 2026

Industrial edge systems increasingly combine heterogeneous processor architectures, AI acceleration and structured cybersecurity to meet performance and regulatory requirements. At Embedded World 2026 in Nuremberg from March 10 to 12 (Hall 3, Booth 159), Kontron will present a portfolio of embedded and edge AI platforms designed for secure, connected and Cyber Resilience Act (CRA)-aligned deployments.

The exhibition centers on new hardware platforms, AI acceleration options and lifecycle security frameworks that support industrial IoT and edge computing environments.

Intel Core Ultra Series 3 at the industrial edge
A key focus is Kontron’s integration of Intel^® Core™ Ultra Series 3 processors (codename Panther Lake) into industrial platforms. The processor architecture combines CPU, GPU and an integrated Neural Processing Unit (NPU), enabling AI workloads such as image processing, machine vision and data analytics to run directly at the edge.

By consolidating compute and AI acceleration on a single platform, systems can execute inference tasks locally with reduced latency and without additional external accelerators. This architecture supports energy-efficient edge AI processing for applications requiring real-time responsiveness.

At the event, Kontron will introduce the 3.5" SBC PTL single-board computer designed for industrial applications. The platform is engineered for long-term availability and compliance with open standards. It is AI-ready and incorporates lifecycle management and cybersecurity mechanisms aligned with CRA requirements.

Kontron is also participating in the Intel Innovation Pass Program, linking its booth activities with Intel-based solution discussions.

Expanding across Intel, AMD and Arm architectures
Beyond Intel-based platforms, Kontron will showcase the K4131-Px mITX industrial motherboard built on the AMD Ryzen™ AI Embedded P100 processor series. The board targets industrial and edge AI applications requiring high graphics and AI performance, extensive display connectivity and flexible expansion options. The SMARTCASE™ S740 enclosure complements this motherboard for system-level deployment.

Kontron is also extending its Arm portfolio with the OSM-S AM62L system-on-module, compliant with the OSM standard and based on the dual-core Arm^® Cortex^®-A53 processor from Texas Instruments. Designed for energy-efficient, fanless embedded designs, the OSM approach supports compact layouts and accelerates development cycles through standardized module integration.

This multi-architecture strategy enables system designers to select compute platforms based on workload profile, power envelope and lifecycle constraints rather than vendor-specific limitations.

AI acceleration up to 50+ TOPS in box PCs
At the system level, Kontron will present AI- and CRA-ready box PCs for 24/7 industrial operation. The KBox platform can be expanded with a new SiMa mezzanine card that adds MLSoC acceleration.

By combining Intel^® Core™ processors for control and visualization with SiMa.ai acceleration, the system can deliver more than 50 TOPS of edge AI performance. Target workloads include multi-camera image processing, machine vision and multimodal generative AI. The architecture is designed to operate without requiring changes to existing software stacks, reducing integration complexity and avoiding vendor lock-in.

Integrated security stack and lifecycle governance
To address cybersecurity and lifecycle management requirements, Kontron integrates KontronAIShield and KontronOS into its platforms. These components support secure boot mechanisms, structured vulnerability management, system updateability and protection against unauthorized access throughout the product lifecycle.

The Kontron ToolSuite provides scalable configuration of system parameters and BIOS settings for industrial deployments. Together, these elements form a security ecosystem aligned with CRA obligations for products with digital elements connected to networks.

In the context of increasingly regulated edge computing environments, integrating security mechanisms at both firmware and operating system levels supports traceability and long-term maintenance.

5G connectivity and mission-critical systems
The trade fair presentation also includes 5G industrial modules that are in series production. Designed for connected and data-intensive edge and IoT scenarios, these modules target industrial automation, railway and avionics applications where high bandwidth and low latency communication are required.

For aerospace and defense use cases, Kontron will present the µDARC platform for compact mobile systems and the HARAKAN-F platform for high-performance operation in demanding environments. A live demonstration will illustrate deterministic, time-critical networking and real-time data exchange across distributed embedded systems, highlighting suitability for mission-critical applications.

From prototype to series production
Under its Electronics² service brand, Kontron will also present rapid prototyping capabilities. Beflex electronic, part of the Electronics² network, supports development from functional samples through to small-series production. Rapid transition from design to manufacturing enables shorter development cycles and earlier validation of embedded hardware concepts before volume production.

Across its exhibition portfolio, Kontron combines heterogeneous processor platforms, edge AI acceleration, integrated cybersecurity and connectivity to address industrial IoT deployments that must balance performance, compliance and long-term lifecycle management.

www.kontron.com