Yamaha Motor launches YRH10W hybrid placer for 12-inch wafers and large PCB handling
High-speed, high-accuracy hybrid placer for advanced semiconductor and power electronics production.
www.yamaha-motor.com
Yamaha Motor has announced the release of the YRH10W hybrid placer, a wide-type model that combines surface mounting and die bonding in a single platform, addressing growing demands in automotive and power electronics manufacturing.
The new YRH10W will be launched on 1 March 2026 by Yamaha Robotics. It builds on the existing YRH10 hybrid placer, extending compatibility to 12-inch wafers and enabling transport of large printed circuit boards up to L510 × W460 mm, while maintaining high-speed and high-accuracy performance.
Designed for evolving semiconductor and automotive markets
Driven by the rapid growth of new energy vehicles (NEVs), the automotive electronics market increasingly requires efficient, highly reliable power modules. At the same time, semiconductor manufacturers are shifting toward 12-inch silicon wafers to reduce unit costs, creating demand for mounting equipment capable of handling larger wafers and carriers.
The YRH10W was developed to meet these requirements, supporting batch mounting processes where multiple circuit boards are arranged on large carriers and mounted collectively for higher efficiency.
High-speed, high-accuracy hybrid placement
By combining the precision technologies of the YRH10 with Yamaha Motor’s proven high-speed surface mounting expertise, the YRH10W delivers:
- Bare-chip placement speed of up to 14,000 CPH when supplied with wafers
- Mounting accuracy of ±15 μm
- Support for mixed mounting of surface-mount devices and bare semiconductor dies
Advanced functions such as optimized axis control, thermal compensation, mounting height compensation, and load control help ensure stable, repeatable, high-quality placement even on warped or uneven PCBs. The All Image Tracer function further supports quality control by storing component recognition images to help identify potential defect causes at an early stage.
Wide versatility in a single machine
In addition to supporting 6-inch, 8-inch, and 12-inch wafers on one platform, the YRH10W features a high-rigidity conveyor system that enables accurate transport of large PCBs. Optional functions such as the solder paste transfer unit and fiducial camera Z-axis variable control allow the machine to support diverse production processes, including modular and power electronics products.
This versatility enables manufacturers to consolidate processes and reduce the number of machines required on the production line.
User-friendly operation and smart factory integration
The YRH10W inherits Yamaha’s user-oriented design philosophy. Visual setup tools simplify wafer pickup condition settings without requiring specialist skills, while enhanced support functions—such as placement sequence optimization and cycle time estimation—help maximize overall equipment effectiveness.
As part of Yamaha Motor’s 1 Stop Smart Solution concept, the YRH10W integrates seamlessly with the company’s broader lineup of printers, dispensers, inspection systems, and surface mounters, supporting the realization of intelligent, highly coordinated SMT production lines without black-box equipment.
First public display at NEPCON JAPAN 2026
The YRH10W hybrid placer will be exhibited for the first time at NEPCON JAPAN 2026, held at Tokyo Big Sight from 21–23 January 2026. Visitors will be able to see how the new platform supports next-generation semiconductor and electronics manufacturing requirements.
With the YRH10W, Yamaha Motor strengthens its position as a comprehensive supplier of advanced mounting solutions, enabling higher productivity, flexibility, and quality in power electronics and automotive manufacturing.
www.yamaha-motor.com
