Siemens Digital Industries Software today announced a range of expanded electronic design automation (EDA) early design verification functionalities for its Calibre^® platform for integrated circuit (IC) physical verification.

The SINUMERIK Run MyRobot /Direct Control application allows machine tool users to integrate the mechanical robot model into the CNC for machine interaction and control. As a result, no additional robot controller is required.

At the TSMC 2022 Technology Symposium, Siemens Digital Industries Software today announced that its ongoing collaboration with longtime foundry partner TSMC has resulted in new product certifications for several of Siemens’ most advanced toolsets.

Embarking on the digital journey with SINUMERIK ONE reduces product development cost
and time-to-market, plus the company will display an expanded hardware, software and service portfolio to help pave the way towards digitalization.

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.

Siemens Digital Industries Software announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud.

Siemens Digital Industries Software has today announced that its Additive Manufacturing Network platform has been implemented at Schaeffler, a global automotive and industrial supplier, to connect its community of design engineers with its AM Fab Shop for additive manufacturing to facilitate collaboration, speed time to production and to foster greater application of the benefits of additive manufacturing (AM) within its value-chain.

Siemens Digital Industries Software has released the latest version of Parasolid^® software, its open geometric modeling technology employed by over 4 million users across the world.

New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.

Bringing the proFPGA technology and team in-house can allow Siemens to more fully integrate and optimize the scalable, high-performance prototyping platform for lab and desktop environments into its Veloce hardware-assisted verification system.