Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Decarbonization is a key focus for leading design, engineering and manufacturing organizations. To provide access to the most up to date CO2e emission data for materials and energies, Siemens Digital Industries Software today announces its collaboration with sustamize GmbH, a leading ClimateTech company providing professional technology, data and software solutions enabling companies to measure, optimize and manage CO2 emissions.

Under the motto "Accelerate digitalization for a sustainable tomorrow", Siemens will be demonstrating at this year's AMB how the enormous potential for optimizing machine tools can be utilized thanks to the continuous analysis of production data.

To address the design verification challenges of the world’s most complex mixed-signal systems-on-chip (SoCs), Siemens Digital Industries Software today introduces the new Symphony Pro platform.

Siemens Digital Industries Software today announced a range of expanded electronic design automation (EDA) early design verification functionalities for its Calibre^® platform for integrated circuit (IC) physical verification.

The SINUMERIK Run MyRobot /Direct Control application allows machine tool users to integrate the mechanical robot model into the CNC for machine interaction and control. As a result, no additional robot controller is required.

At the TSMC 2022 Technology Symposium, Siemens Digital Industries Software today announced that its ongoing collaboration with longtime foundry partner TSMC has resulted in new product certifications for several of Siemens’ most advanced toolsets.

Embarking on the digital journey with SINUMERIK ONE reduces product development cost
and time-to-market, plus the company will display an expanded hardware, software and service portfolio to help pave the way towards digitalization.

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.

Siemens Digital Industries Software announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud.