ADLINK will introduce advanced OSM modules, Edge AI accelerators, and AI-powered vision systems, enhancing robotics, automation, and real-time decision-making in industrial applications.

Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment.

Two new series of Mini-ITX motherboards provide power-efficient and high-performance options for edge AI applications.

Experience unparalleled efficiency in a compact design, ideal for maximizing space in constrained environments.

By realizing the power of generative AI and digital twin, ADLINK can seamlessly bridge physical and virtual worlds to pave the way for future innovations.

ADLINK will be debuting its OSM product line of embedded modules in a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) at Embedded World 2024, Hall 3, Booth 147.

ADLINK Technology to Showcase Latest Processor Integration and Edge AI Platforms at Embedded World 2023, with Product Managers and Key Executives on Hand to Provide Industry Insight.

With its MLB-3000 and MLB-3002 systems, ADLINK Technology's Healthcare Business Center is presenting two new real-time capable medical computing platforms for AI-supported imaging processes.

Two-day virtual event will explore the integration of edge computing and AI, industry trends and display technologies.

Breakthrough Intel^® Core technology with ADLINK Computer-on-Modules allow for hybrid architecture performance and a wide variety of deployment scenarios with superior performance.