TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.

TDK Corporation presents the new B78302A* series of compact EPCOS transformers with innovative E5 cores for ultrasonic applications.

Factories and manufacturing sites need to prevent anomalies in machinery and equipment to minimize downtime. Productivity can be raised by predicting problems and performing maintenance preemptively, instead of reacting only after breakdowns have occurred. To facilitate this type of predictive maintenance, TDK has developed i3 Micro Module—the world’s first ultracompact sensor module featuring embedded edge AI.

The TDK Robokit1 combines sensors, processors, and actuators on a single board, making it an ideal robotics platform for quick prototyping and development. RoboKit1 integrates key product offerings such as 6-axis IMU, industrial IMU modules, capacitive barometric pressure sensor, digital I²S microphone, temp sensor, ultrasonic Time of Flight (ToF) sensors, magnetometer, and motor controller on a single PCB.

TDK Corporation (TSE:6762) announces that the InvenSense ICP-20100, the latest generation of the SmartPressure MEMS Barometric Pressure Sensors, is now in mass production and has been certified by NextNav. Launched in 2021, the NextNav Certified process independently verifies the InvenSense sensor accuracy measurements, by engaging directly with component manufacturers to rigorously test sensors in real world operating scenarios.

TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in wireless communications disruptor XCOM Labs to expedite the development of their 5G and wireless communications solutions, which emphasize bandwidth capacity, latency reduction/elimination, and compute load balancing.

TDK Corporation (TSE: 6762) presents the AVD series of new pressure transmitters, distinguishable by their extremely low-profile design and high precision. The transmitters with B58621V* ordering codes are available in three versions for different pressure measurement ranges including 0 to 16 mbar, 0 to 100 mbar, and 0 to 7 bar.

TDK Corporation (TSE:6762) announces the new DBM20/ZBM20 and ZBM-AC of TDK-Lambda buffer modules. TDK-Lambda Corporation (President and CEO: Sanai Hattori) will start accepting orders from February 2022.

TDK Corporation (TSE: 6762) has extended its range of bipolar DC high-voltage contactors to include the new HVC43 (B88269X3**0C011) series. These products complete the existing range by offering continuous currents from 150 A DC to 250 A DC and operating voltages of up to 1000 V DC. The contactors are available in 12 V or 24 V coils with a power consumption of 6 W.