CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

CEA-Leti scientists achieved three key projects at ECTC 2024, enabling a new generation of CMOS image sensors capable of utilizing all image data to perceive, understand, and intervene in scenes, requiring AI embedding.

CEA-Leti has developed a keyword-spotting system that enhances accuracy in voice-activated Edge-AI systems, consumes less power, and has a smaller silicon footprint than current technology.

CEA-Leti at IEDM 2023 has described the world’s-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.

Unlike PZT-Based Ferroelectric Memories, These Devices Are Fully Compatible With CMOS Processes, Scalable to Advanced Nodes and Lead-Free.

Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber For Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses.

Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces.

OPAs with Solid-State Beam Steering Can Reduce the Cost and Size of LiDAR Systems & Improve Performance; Results Reported at Photonics West 2021.

CEA-Leti scientists have demonstrated a machine-learning technique exploiting what have been previously considered as “non-ideal” traits of resistive-RAM (RRAM) devices, overcoming barriers to developing RRAM-based edge-learning systems.